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Latest issues of B&S and ECE Magazine
ECE Magazine
Cover Story:
Partitioning a single-chip system for safe and non-safe applications
B&S Magazine
Cover Story:
AMD G-Series SOC integrates CPU, GPU and I/O controller onto a single die
ATCA & MTCA - overview of the dot-specifications, actual status and market requirements
Presented by Schroff
This presentation gives an overview about the TCA specifications and sub-specifications showing the special features and the intended use. In addition it will highlight the current and future technical requirements for the different TCA flavours and how to achieve them. 9 years after the release of the first TCA (Telecom Computing Architecture) specification PICMG 3.0 – AdvancedTCA the requirement for power and cooling increased dramatically. Additional need from the Telecommunication market for smaller size chassis were covered by the implementation of the MicroTCA.0 specification, released in 2006. Other market segments like Industrial, Test & Measurement & Defense adapted the TCA technology and created sub-specifications to implement their additional requirements for the TCA standards.
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