Maximize uptime in the connected factory

By Joe Lin, NEXCOM

Monitoring the many devices that keep today's production lines running in optimal condition is a major challenge. This article will explain how the fanless industrial computers NISE 3640 can be used as a control and communication gateway that links cross automation hierarchy levels to monitor and control the devices connected to it in real time.

NEXCOM's NISE 3640 brings together the 3rd generation Intel Core processor, NEXCOM XCare remote monitoring and management software, and McAfee Solidcore security software; and uses the Intel Intelligent System Framework which gives developers a standards-based, interoperable platform for connectivity, security, and manageability....

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Dual-channel colorimeter with programmable gain transimpedance amplifiers and synchronous detectors

This “Circuits from the Lab” paper introduces a dual-channel colorimeter with programmable gain transimpedance amplifiers and synchronous detectors that measures the ratio of light absorbed by the sample and reference containers at three different wavelengths. Circuits from the Lab reference circuits are engineered and tested for quick and easy system integration to help solve today’s analog, mixed-signal, and RF design challenges.

The circuit provides an efficient solution for many chemical analysis and environmental monitoring instruments used to measure concentrations and characterize materials through absorption spectroscopy. The photodiode receiver conditioning path includes a programmable gain transimpedance amplifier for converting the diode current into a voltage and for allowing analysis ofdifferent liquids having wide variations in light absorption. The 16-bit sigma delta (Σ-Δ) analog-to-digital converter (ADC) provides additional dynamic range and ensures sufficient resolution for a wide range of photodiode output currents…

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TI Solutions for Sensing Applications

Abstract:

• During this webinar, participants will receive an overview on different sensor applications and TI solutions to support them.  Through various concrete examples like temperature, analytical and gas sensing, the session will detail the sensing principles (RTD, thermocouple, electrochemical cells, etc.) and the main design challenges involved. Finally the appropriate TI solution will be explained to understand the benefits it brings to the sensing application.

TI Speakers:

• Giancarlo Candela, Precision Analog Solutions EMEA Systems Applications
• Carine Alberti, Business Development Sensing Solutions

Date & Time:

• The webinar will start on June 12 at 15h00 (Central European Summer Time)
• Including Q&A session the webinar will take around 45 minutes

Register now for this free Webinar. The number of “seats” is limited.

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Benchmarking of in-memory & on-disk databases

This White Paper is presented by McObject

Will an IMDS (in-memory database system) with transaction logging outperform a traditional DBMS? Will type of storage – hard disk drive vs. SSD vs. state-of-the-art memory-tier device – affect any performance difference? McObject’s benchmark report answers these questions with tests using IMDS and on-disk DBMS technology.

It also examines the impact of transaction length (long vs. short) on database system performance and the interplay of storage device type with this effect.ill an IMDS with transaction logging outperform a traditional DBMS? Will type of storage – hard disk drive vs. SSD vs. state-of-the-art memory-tier device – affect any performance difference?

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Efficient remote management for embedded platforms

This White Paper is presented by AMD

Out of Band (OOB) remote management can help to optimize the total cost of ownership of distributed embedded platforms. However, existing implementations are over designed and therefore too costly for embedded systems applications. Now, AMD has created an open source solution that removes the bloat of costly implementations while retaining the essentials of a compliant OOB implementation.

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Isolated interface solutions for industrial sensor and monitoring applications

This webcast is held in German language. It will review designs in which isolation is needed to protect personnel and equipment from harsh electrical environments. Presentation will detail interface power requirements and approaches for achieving design objectives. Topics will include performance tradeoffs for various approaches and applicable safety certifications for interface components.

Target Audience?
Design Engineers doing low power industrial process control or instrumentation designs who are looking to increase speed and save board space on their current design while improving long term reliability.

Presenter:
Michael Müller-Aulmann, Senior Applications Engineer, iCoupler® Digital Isolator Group, Analog Devices, Inc. He began his career at Analog Devices in 2000 as a Distribution Support Manager and as a Key Account Manager for the areas Nordrhein-Westfalen and Rheinland-Pfalz. After having worked as a Senior FAE since 2002 Michael switched to the Product-Line in early 2005 and since then he has been responsible for the Precision Analog Microcontrollers and iCoupler®. Michael holds a Dipl.-Ing. (FH) Degree in Electrical Engineering from Technical University Bingen. He works closely with developers in Ireland and the USA at definition and development issues.

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A beginner’s guide to the AMD Embedded G-Series APU with OpenCL

This paper provides an introduction to the AMD G-Series APU and operating systems that support these devices. It also introduces the reader to the OpenCL framework and programming model and contains an in-depth tutorial on working with AMD’s Accelerated Parallel Processing Software Development Kit (AMD APP SDK) including creating your first OpenCL program.

Combining a low power CPU with a multicore high-performance GPU on the AMD Embedded G-Series APU opens up new processing opportunities for embedded applications. But how do you take full advantage of the processing power? What software is available and what can it do? How does OpenCL help you get the most processing performance possible from the AMD G-Series APU...

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Building the new world of intelligent systems

By Ton Steenman, Vice President and General Manager, Intel Intelligent Systems Group

A new era of pervasive computing is upon us. The proliferation of devices, connections, and data is weaving computing into every aspect of daily life, making possible unprecedented opportunities for innovation, advancement, and growth on a global scale.

This calls for embedded designs that go beyond the traditional isolated, fixed-function devices. What’s needed now is a new class of solutions with the intelligence and connectivity to support this new pervasive computing model. From cars that keep drivers and passengers more informed, safer, and entertained to digital displays that tailor information for each shopper, such intelligent systems are more networked,more context-aware, and more adaptive to users’ needs. This new breed of systems delivers enhanced productivity, better experiences, and improved efficiency for businesses and consumers alike...

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